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- PRODUCT
- Flux Pre-Cleaning System
Flux Pre-Cleaning System
- Solder Ball Attach
- Marking System
- Laser Drilling
- PKG Stack System
- Package Laser Saw System
- Flux Pre-Cleaning System
- Substrate Merge & Sorting System
- Loader & Offloader System
- Router System
- Solder Ball Attach Tool Kit
- Pick & Place System
- Other Equipment
- Display
Flux Pre-Cleaning System
KPM300
| 파일명 | Download |
|---|
- System Specification
| Item | Description |
|---|---|
| Cleaning method | Stencil squeeze |
| Application package | All Package _OSP, Via hole flux cleaning |
| Package length | 170mm ~250mm |
| Package width | 60mm ~ 100mm |
| System alignment | Strip guide block/ Controlled location pin hole |
| Special function | Blade force controlled by motor Optimized blade angle, Special station block Key in history |
| MTBA | 2hrs |
| MTBF | 168hrs |
| S.P.M | OSP stencil cleaning : 6strip/min Via Hole cleaning : under 4trip/min |
| Up time | 99% |
| Conversion Parts | Stencil, Urethane, station block |
